Exhaustive proofs are the only way to find deep corner-case bugs that can result in deadlocks and silent data corruption.

Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?

As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvilinear-native data flows to keep turn ...

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

If you’re working on standard-cell libraries at 28 nm or below, you already know the math isn’t in your favor. At the 130 nm ...

Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has ...

Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

Manufacturing, Packaging, Materials Navigating Increased Complexity In Advanced Packaging Intel Vs. Samsung Vs. TSMC Hybrid Bonding Makes Strides Toward Manufacturability 3.5D: The Great Compromise ...

Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

As chips become more complex and packaging options multiply, designers have more choices than ever for connecting system ...