For decades, chipmakers squeezed more transistors onto processors by shrinking them sideways. That playbook is running out of ...

TSMC is building five fabrication plants for its 2nm process node in Kaohsiung, Taiwan, a concentration of cutting-edge ...

Wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch demonstrated.

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on ...

Is the market giving investors a good opportunity to buy this AI disruptor?

Cerebras is expected to make its public debut on Thursday, and investors just can't wait. After its initial public offering (IPO) filing a couple of weeks ago, the offering is 20 ...

Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation ...

KLA (KLAC) is not like other semiconductor equipment companies, and that difference is becoming more important as AI drives a shift in how chips are manufactured. Specifically, KLAC primarily designs ...

Silicon is the second most abundant element in Earth’s crust, but is rarely found in pure form. High-purity quartzite (SiO 2) is reduced in an electric arc furnace at around 1,800 °C using carbon ...

Cerebras Systems and the federal Department of Energy's National Energy Technology Laboratory today announced that the company's CS-1 system is more than 10,000 times faster than a graphics processing ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...